Specifications
Knowing what's behind it
Every circuit board, every prototype and every series that leaves our company is checked beforehand using AOI (Automatic Optical Inspection). Hidden solder joints (QFNs, BGAs) are spot-checked using X-ray. This enables us to offer you a fast and reliable series start-up.
AOI
In addition to the presence of the components, the AOI also checks their polarity and position, the correct component designation and, of course, the quality of the solder joint.
X-Ray
However, for components with connections on the underside of the component, such as BGAs and QFNs, the solder joints can only be inspected using X-rays. Automatic optical inspection is not sufficient here.
Analytics
With our in-house analytics (fully-fledged grinding laboratory), we are also able to carry out materialographic tests to increase process safety and reliability.